Original
By certification 
The main components of the microporous board is nano silicon dioxide and silicon carbide. It is a new type of heat insulation material obtained after a series of physical and chemical reactions, consisting of silicon dioxide particles with diameters of tens of nanometers, and infrared sunscreens and fibers. The thermal insulation performance of microporous board is lower than that of still air, which can greatly reduce the energy consumption of equipment and reduce the thickness of the required thermal insulation layer.
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1. Small specific heat, low heat storage, and thermal shock resistance. Temperature resistance up to 1100°C
2. An ideal high-temperature thermal insulation material.
3.Good thermal stability, less heat storage, thermal shock resistance, and long service life.
4. Non-toxic and environmentally friendly
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Microporous board is suitable for applications with high requirements for thermal insulation and energy saving, or occasions where the thickness of the thermal insulation material is limited, such as Iron and steel metallurgical equipment, Ceramic furnaces, Glass furnaces and other industries.
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|
Brand Property |
TP950 |
TP1000 |
TP1100 |
|
|
Melting Point (℃) |
≥1200 |
≥1200 |
≥1200 |
|
|
Operating Temperature (℃) |
950 |
1000 |
1100 |
|
|
Density (kg/m³) |
280-350 |
550-650 |
550-650 |
|
|
Compressive strength (MPa) |
0.5 |
0.8-1.2 |
0.8-1.2 |
|
|
800℃ Heating wire shrink 800℃ (%) |
≤1.9 |
≤1.9 |
≤1.9 |
|
|
  Thermal Conductivity （w/m.k）  |
200℃ |
0.016 |
/ |
/ |
|
 |
400℃ |
0.021 |
0.043 |
0.047 |
|
 |
600℃ |
0.026 |
0.057 |
0.058 |
|
 |
800℃ |
0.035 |
0.063 |
0.069 |
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